Industries Served Electronics

Toagosei America supports the electronics industry with a robust portfolio of electronic resin products, including UV coatings, adhesives, ion scavengers, CTE additives, UV monomers, oligomers, and more. Our products are engineered to support evolving manufacturing needs across optical fibers, circuit boards, photo-resists, electrical conductors, and LCD, OLED, and LED display panels—areas seeing rising demand for energy-curable coatings and specialized adhesives.

We understand that UV-curable materials for electronics require precision chemistry and specialized expertise. Whether you need standard materials or a custom formulation, our team can develop a solution by leveraging deep knowledge of structure-property relationships specific to electronics.

Our Solutions for the Electronics Industry

Toagosei America offers a comprehensive selection of coatings, adhesives, and specialty materials that protect, enhance, and extend the life of sensitive devices and components.

UV Hard Coatings

Toagosei UVX-6524 is our UV hard coating designed for electronic optical display applications. It cures under ultraviolet light and is used to protect optical films in monitors, smart device screens, and related assemblies. The coating helps prevent scratches, moisture intrusion, and UV-related degradation while maintaining a smooth, uniform surface.

Benefits of use with electronics:

  • Produces a clean, attractive appearance on goods requiring frequent handling
  • Solvent-free composition with minimal VOC emissions
  • Easy application and rapid UV curing without the need for solvent drying

UV Curable Conformal Coatings

Toagosei America’s UV-curable conformal coatings are designed to protect a wide range of electronic components from environmental stress. These transparent coatings conform to complex shapes and surface features, forming a durable barrier against moisture, dust, chemicals, heat, and UV exposure. Their reliable performance makes them well-suited for use in applications such as printed circuit boards, flexible printed circuits (FPCs), and other sensitive electronic assemblies.

Key benefits include:

  • Solvent-free formulation for safer handling and reduced environmental impact
  • Strong adhesion to FPCs and other substrates
  • Helps prevent short circuits and damage from contaminants
  • Transparent finish supports inspection and electrode corrosion monitoring
  • Fast UV curing reduces cycle times
  • Contributes to lower operating costs and smaller manufacturing footprint

Adhesives

Toagosei America offers multiple types of adhesive for electronics, including:

  • Aron Alpha® instant adhesives
  • Aron Ceramic® high heat-resistant inorganic adhesives
  • Low dielectric epoxy adhesive films
  • UV Adhesives for optical and precision electronic applications

Aron Alpha® is ideal for rapid assembly, forming strong bonds without heat treatment. It offers chemical resistance, low toxicity, and availability in a range of product grades to suit different applications.

Aron Ceramic® delivers exceptional thermal stability, with bonds that hold at temperatures up to 1000-1200  °C. (1832-2192 °F) It is ideal for bonding metals and ceramics in high-heat electronic environments.

Aronix® Sheet

Aronix® Sheet is a durable, optically clear resin sheet used as a glass alternative in electronic screens and LIDAR Sensor Lens covers. It supports touch sensor capabilities and is ideal for smartphones, tablets, and in-vehicle displays. The material is lighter than glass and highly resistant to heat, chemicals, and scratches.

Key benefits:

  • High transparency with low retardation for precise touch response
  • Excellent durability in harsh environments, including automotive use
  • Easy to machine using CNC routers or laser cutters for reduced assembly costs

Ion Scavengers (IXE, IXEPLAS®)

Our IXE® inorganic ion exchanger enhances the performance of sealants used in IC circuits (EMC, liquid encapsulants, underfill materials, die bonding film), adhesives for FPC, solar cell components (back sheet, the sealing resin), resist ink, and more. It offers superior ion trapping and thermal resistance, improving the reliability of IC sealants.

For even finer applications, IXEPLAS® provides the same core benefits with smaller particle sizes—ideal for use in semiconductor packages.

ULTEA® Sealants for Electronics

ULTEA® is a negative thermal expansion filler made from heavy-metal-free zirconium phosphate. It is designed to suppress the expansion of glass and resin caused by heat, making it essential for OLED encapsulants and electronic sealants.

Key benefits include:

  • Contracts when heated, counteracting thermal expansion
  • Enhances heat and chemical resistance when added to resins, glass, and other materials
  • Prevents cracking

Learn More About Our Chemical & Adhesive Solutions for Electronics

Toagosei America supplies a range of materials designed to support the electronics industry and others. Our solutions include UV coatings, adhesives, resin sheets, ion exchangers, and thermal expansion fillers—each developed to address specific challenges in electronic assemblies.

Our products are formulated and produced at our Ohio facility or imported from Toagosei Japan, all under strict quality control. Our in-house R&D team is available to support technical inquiries, and our sales and customer service teams can assist in selecting materials that meet your requirements.

For more information, contact us or view our data sheets.