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The increasing demand for high-performance semiconductor devices has accelerated the adoption of copper wiring in electronic packaging due to its excellent electrical and thermal conductivity and lower cost compared with traditional gold wiring. However, copper is more susceptible to electrochemical migration, a degradation phenomenon that can lead to short circuits and reduced device reliability, particularly under high-temperature and high-humidity operating conditions. One of the primary factors contributing to copper migration is the presence of ionic contaminants, especially chloride ions, within semiconductor encapsulation materials. Although efforts have been made to reduce impurity levels through improved resin synthesis and material purification, complete elimination of ionic contaminants remains challenging because encapsulants contain multiple components, including resins, curing agents, fillers, and additives. Consequently, ion-scavenging technologies have emerged as an effective approach for improving package reliability. In response to these challenges, Toagosei developed IXE-700H, a novel inorganic anion exchanger with enhanced chloride-ion capture capability, high heat resistance, and excellent performance under near-neutral pH conditions. This paper examines the properties, ion-exchange performance, and reliability-enhancing effects of IXE-700H, highlighting its potential to suppress copper migration and improve the long-term durability of advanced semiconductor packaging materials.