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The reliability of semiconductor packages is a critical factor in the performance and longevity of modern electronic devices. In recent years, the semiconductor industry has increasingly adopted copper wire in place of gold wire because of its lower cost, higher electrical conductivity, and superior thermal conductivity. However, copper is more susceptible to oxidation, corrosion, and electrochemical migration, which can reduce package reliability and increase the likelihood of electrical failure. Previous studies have identified free chloride ions and acidic conditions within encapsulation materials as key contributors to copper degradation. To address these challenges, ion-exchange materials have been developed to selectively remove harmful ionic contaminants from electronic materials. This paper investigates the effects of Toagosei’s inorganic ion exchangers, IXE® and IXEPLAS®, on the reliability of copper wiring packages. By examining their ability to scavenge chloride ions, modify resin chemistry, and suppress electrochemical migration, the study evaluates their effectiveness in enhancing the durability and long-term performance of copper-based electronic packaging systems.